Head of Power Packaging & SiC/GaN Technology

renesasAustin, TXyesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Electronic Connector Manufacturing

Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification. The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.

Apply now

Level

ManagerL7

Location

Austin, TX

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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