Senior RF Hardware Engineer – CMOS/RFIC Innovation

Qualcomm Technologies, Inc. is seeking a senior member of the Si Process Packaging Solutions team to drive silicon process technology evaluation, development, and productization for Mixed-Signal/RF products with foundry partners. You will evaluate bulk Si and RFSOI technologies, define device requirements, and run DOE, layout, and characterization to meet design needs, while interfacing with cross-functional teams and driving continuous improvements across RF circuits and device models.