Senior IC Package Layout Lead (2.5D/3D-IC)

Annapurna Labs (U.S.) Inc. in the USA is seeking a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for next-generation ML and data center ASICs. You will own the package layout from floor planning through tape-out, coordinating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets. You will drive cross-level optimization across die RDL, interposer/substrate, and PCB to ensure optimal power delivery and high-speed