Director, Power Packaging & SiP Innovation

Renesas Electronics Corp. seeks a senior packaging leader to drive technology development for AI/datacenter power packaging, including Smart Power Stages and Power Modules. You will guide interconnect solutions, participate in roadmap planning, and oversee budget and supplier relationships with OSATs and contract manufacturers. The role emphasizes wafer-level and flip-chip packaging knowledge, DOE-driven process optimization, and collaboration across product, reliability, quality, and operations