Distinguished Engineer AI Silicon Thermal Architecture

The Role: As ZutaCore's Distinguished Engineer for AI Silicon Thermal Architecture, you will define the long-term vision for how thermal technologies evolve alongside next-generation AI silicon with a sharpening focus on integrating cooling directly into the package. Rather than focusing on a single product, you'll work across emerging GPU, AI accelerator, and advanced packaging roadmaps to determine where cooling technology must go over the longer term while contributing directly, right now, to the product, technology, and partnership decisions that get us there. Working closely with Product, Engineering, Business Development, and strategic silicon partners, you'll translate technology trends into product strategy and partnership opportunities that shape the future of our company.

What You'll Do: Own ZutaCore's long-term AI silicon thermal integration roadmap and help drive the near-term milestones. Evaluate emerging AI architectures, advanced-packaging technologies, and power-delivery trends to define future cooling strategies. Develop the strategies for integrating cooling into the package across the lid/IHS, interposer, and substrate that meet the full thermal and mechanical demands of 2.5D and 3D heterogeneous integration, chiplets, memory, co-packaged optics, and next-generation substrate architectures. Partner with engineering teams to translate technology vision into executable roadmaps and identify the near-term product and technology decisions that move them forward. Collaborate and co-design with leading semiconductor companies, foundries, OSATs, hyperscalers, and strategic ecosystem partners. Represent ZutaCore externally through customer engagements, technical conferences, standards organizations, and industry thought leadership.

Required Qualifications: 10+ years of experience in semiconductor architecture, AI systems, advanced packaging, or high-performance computing. Deep knowledge of advanced semiconductor packaging and heterogeneous integration and their thermal implications, including 2.5D and 3D integration, chiplets, interposers and bridges, HBM, advanced substrates, and co-packaged optics, and a clear view of why cooling must move closer to the silicon. Deep understanding of GPU and AI accelerator architectures with the ability to think beyond individual products toward long-term industry evolution. Demonstrated experience defining multi-year technology strategies or roadmaps, paired with a track record of delivering in the near term. Ability to bridge semiconductor architecture, thermal engineering, product strategy, and business priorities. Exceptional communication skills with both executive and highly technical audiences.

Preferred Qualifications: Experience with liquid cooling, two-phase cooling, microfluidics, or other advanced thermal technologies. Hands-on experience co-designing package-level thermal integration with leading semiconductor companies, foundries, OSATs, or packaging houses. Active participation in industry organizations such as OCP, Hot Chips, Ashrae, ECTC, iTherm, or similar technical communities. Publications, patents, or recognized technical leadership within the semiconductor ecosystem. The AI revolution is rewriting the rules of semiconductor design, and cooling is becoming one of the industry's greatest challenges. At ZutaCore, you'll help define how the next generation of AI processors is designed, packaged, and cooled, working alongside some of the world's leading engineers and technology partners. If you're excited by solving problems that don't yet have established answers, we'd love to meet you.