Senior IC Packaging Design Engineer High-Performance Substrates

Tessolve Semiconductors is hiring IC Packaging Design Engineers for Chandler, AZ (primary) or Hillsboro, OR (secondary). Senior candidates with 10+ years are preferred; mid-level (4–6+ MS / 6+ BS) are also considered. You’ll design IC packages, drive substrate layout, and ensure reliability, manufacturability, and SI/PI-aware implementations. Join a leading semiconductor engineering firm and work on cutting-edge packaging projects with flexible location options in Chandler, AZ or Hillsboro, OR.