Senior Director, Chiplet Packaging & FCBGA Programs
amkor technologyTempe, AZ
Senior Director, Chiplet Packaging & FCBGA Programs
L7
amkor technologyTempe, AZtoday
Occupations
Electronics Engineers, Except ComputerArchitectural and Engineering ManagersComputer Hardware EngineersIndustries
Semiconductor and Related Device ManufacturingPrinted Circuit Assembly (Electronic Assembly) ManufacturingSemiconductor Machinery ManufacturingAmkor Technology, Inc. in Tempe, AZ seeks a Senior Director, Chiplets/FCBGA Business Unit to lead a team of BU engineers responsible for program management of advanced packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting computing, networking, and mobile markets.
This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering with Amkor's R&D organization in South
Apply now
Level
ManagerL7
Location
Tempe, AZ
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
today
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