Director of Optoelectronic IC Packaging

Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive advanced package development for custom in-house photonic, analog, and digital ICs, enabling next-gen optical modules. You will own package selection, scheduling, SI/PI optimization, and work with cross-functional groups to optimize silicon floor plans and tapeouts, with a focus on RF performance and manufacturing readiness.