Director, Power Packaging & SiP Innovation

renesas electronicsSan Jose, CAyesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Printed Circuit Assembly (Electronic Assembly) Manufacturing

Renesas Electronics Corp. is seeking a senior Packaging Technology Development lead to drive new package development, qualification and technology roadmaps for AI/datacenter power packaging. You will coordinate with OSAT/CM partners, Product, Reliability and Operations to ensure timely qualification and smooth production ramp. The role focuses on power SiP/modules, wafer-level and flip-chip packaging, DBC/AMB substrates and related interconnects.

Apply now

Level

ManagerL7

Location

San Jose, CA

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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