Advanced Microelectronics Packaging Engineer

L5

saicGranite Heights, WIyesterday
SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems. The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.
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Apply now

Level

SeniorL5

Location

Granite Heights, WI

Occupation

Aerospace Engineers

Industry

Guided Missile and Space Vehicle Manufacturing

Posted

yesterday

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