Senior Packaging Engineer for AI Accelerators
delos dataPalo Alto, CA
Senior Packaging Engineer for AI Accelerators
L5
delos dataPalo Alto, CAyesterday
Occupations
Computer Hardware EngineersElectronics Engineers, Except ComputerPackers and Packagers, HandIndustries
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingElectronic Computer ManufacturingDelos Data Inc. is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for AI accelerators. You will own package architecture, substrate design, manufacturability, and engage with vendors such as TSMC/OSAT to enable next-gen products. You will collaborate with IC design and board teams to ensure system-level package requirements are met, evaluate new packaging technologies, and support bring-up, failure analysis, and qualification.
Apply now
Level
SeniorL5
Location
Palo Alto, CA
Occupation
Computer Hardware Engineers
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
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