Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging)

Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)

Employment Type: Full-time

Department: Design Enablement / Advanced Packaging Technology About Rapidus Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.

Why Join Us: You will play a central leadership role in building the world’s most advanced 2nm and next ‑ generation enablement ecosystem, shaping the foundation for future semiconductor innovation. You will focus on the implementation stages (Synthesis and PnR) of the digital reference flow. Additionally, you will lead the adoption of next-generation automation tools, including AI/ML-driven DSE (Design space exploration)

Key Responsibilities: Customer Design Integration & Enablement Guide customers in effectively applying: Package design rules, libraries, and interface definitions Interposer and substrate architectures Provide technical guidance on chiplet integration, includingHBM, UCIe, PCIe, and high-speed Ser Des Program Execution & Delivery Ownership Drive customer projects towardsuccessful 2.5D/3D package design tape-out and product realization: Manage: Design schedules and milestones Risks, issues, and dependencies Cross-functional action items Lead regular technical and program reviews with customers and internal teams Cross-functional Integration (Core Responsibility) Act as the central coordination point across: Customer engineering teams ADK / Enablement teams Process, manufacturing, and OSAT partners Translate Rapidus technology updates into clear, actionable guidance for customers Ensure alignment between design assumptions and manufacturing capabilities Technical Issue Resolution Support debugging and issue resolution in areas such as: SI/PI and signal integrity challenges Package layout and routing issues ADK usage and interpretation Drive root-cause analysis and coordinate solution deployment across teams Capture customer feedback and drive improvements in: ADK quality and usability Design methodologies and flows Documentation and training materials Contribute to strengthening the chiplet ecosystem and customer readiness

Required Qualifications: B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles Strong understanding of: 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out) High-speed interfaces (HBM, PCIe, UCIe, Ser Des) Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.) Proven ability to manage complex technical programs and cross-functional activities Strong communication skills with customer-facing experience

Preferred Qualifications: Experience in foundry, OSAT, or semiconductor customer support roles Familiarity with ADK / PDK and design enablement flows Experience with die-package-system co-design methodologies Background in HPC, AI, or networking systems Experience in silicon bring-up, validation, or failure analysis Knowledge of advanced substrates (ABF, glass core, fan-out RDL) Japanese language skills for collaboration with Japan-based customers What You Will Impact Ensure successfulcustomer design execution and tape-out delivery Bridge the gap betweenADK (Assembly Design Kit: design environment)andreal product realization Integrate design, technology, and execution into a coherent development flow Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond

What We Offer: Opportunity to play a critical role in customer success for next-generation chiplet platforms Work at the intersection oftechnology, execution, and system integration Collaboration with global teams across the US and Japan Competitive compensation and career growth opportunities Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)