Hardware Intern: Soldering & Packaging Research
L1
ibmYorktown Heights, NYyesterday
Occupations
Computer Hardware EngineersWelders, Cutters, Solderers, and BrazersComputer and Information Research ScientistsIndustries
Electronic Computer ManufacturingPrinted Circuit Assembly (Electronic Assembly) ManufacturingComputer Terminal and Other Computer Peripheral Equipment ManufacturingIBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.
Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.
Apply now
Level
InternL1
Location
Yorktown Heights, NY
Occupation
Computer Hardware Engineers
Industry
Electronic Computer Manufacturing
Posted
yesterday
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