Semiconductor Thermal & Packaging Engineer

Intel Corporation in the United States (Phoenix, AZ) seeks a Semiconductor Research Engineer to drive innovation in devices, packaging, and interconnects. You will design, simulate, and prototype advanced packaging solutions, conducting hands-on experiments and collaborating across teams to advance performance and cost-efficiency. The role emphasizes device physics, thermomechanical analysis, and materials science, with opportunities to lead experiments, develop models, and engage external