Senior Process Engineer, Advanced Packaging & Wafer Tech

Arizona State University seeks a Senior Process Engineer to lead advanced wafer prep and finishing activities within the Advanced Electronics and Photonics Core Facility in Mesa/Tempe. The role focuses on 300mm wafer packaging toolsets, die attach, molding, grinding, wafer saw, and ball drop/reflow, collaborating with device physics, deposition, etching, and photolithography teams. The candidate will develop processes, own equipment like dice saw and wafer grinders, enhance yields, respond to