Lead Power Packaging Engineer – SiP & Wafer-Level Tech
renesas electronicsPhoenix, AZ
$180,000 - $240,000 per year
Apply nowLead Power Packaging Engineer – SiP & Wafer-Level Tech
L7
renesas electronicsPhoenix, AZyesterday
$180,000 - $240,000 per year
Industries
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingElectronic Computer ManufacturingRenesas Electronics Corp. is seeking a senior Package Technology Development leader to drive R&D and NPI for AI/Datacenter infrastructure power packaging.
You will manage OSAT/CM collaborations, define roadmaps, and optimize processes to meet stringent product qualifications. The role requires 15 to 20 years in package development with emphasis on power SiP/module and wafer-level/flip-chip packaging, plus strong analytical and presentation skills.
Apply now
Level
ManagerL7
Salary
$180,000 - $240,000 per year
Location
Phoenix, AZ
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
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