Assembly Supervisor-M

Temp to Hire/Direct Hire for the right candidate 1st shift:7am-3:30pm Key Responsibilities • Perform die attach operations (epoxy, eutectic, and/or solder methods) on ceramic substrates and hybrid circuits • Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards • Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects • Solder fine-pitch components, leads, and interconnects under microscope • Perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) ensuring hermeticity • Conduct in-process visual inspections per IPC/MIL specifications • Read and interpret schematics, assembly drawings, and work instructions • Maintain accurate documentation/travelers for traceability • Troubleshoot assembly issues and recommend process improvements • Maintain a clean, ESD-safe workstation and comply with all safety protocols