Senior Silicon Packaging Architect: End-to-End IC Packaging

Intel Corporation in the United States (Arizona, Phoenix) seeks a Silicon Packaging Design Architect to lead end-to-end packaging solutions across electrical, mechanical, and cost constraints. You will collaborate with silicon, hardware, and package teams to ensure robust production transitions and drive packaging innovations. Senior engineering role focusing on advanced packaging technologies, 3D IC design standards, and continuous improvement of packaging processes and tools.