Senior Physical Design Engineer for AI ASIC & Tapeout

Tenstorrent is seeking a mid- to senior-level Physical Design Engineer to drive the physical design of high-performance AI/ML chips, from synthesis through tapeout. You will collaborate with front-end and physical design teams to optimize floorplanning, timing, power, performance and area across multiple IPs. This hybrid role is based in Austin, TX, Fort Collins, CO, or Santa Clara, CA, and welcomes candidates across experience levels, with offers aligned to the appropriate level.