Advanced Packaging Process Engineer: High-Impact

intelChandler, AZyesterday

Occupations

Packaging and Filling Machine Operators and Tenders Packers and Packagers, Hand Manufacturing Engineers

Industries

Semiconductor Machinery Manufacturing Electronic Computer Manufacturing Semiconductor and Related Device Manufacturing

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production. You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.

Apply now

Level

SeniorL5

Location

Chandler, AZ

Occupation

Packaging and Filling Machine Operators and Tenders

Industry

Semiconductor Machinery Manufacturing

Posted

yesterday

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