Director, Power Package Design & SiP Engineering

renesasPhoenix, AZyesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Printed Circuit Assembly (Electronic Assembly) Manufacturing

Renesas Electronics is seeking a senior packaging technology professional in the United States to lead the development of power SiP/module packaging and wafer-level technologies. You will drive design, qualification, and production ramp with OSAT/CM partners, ensuring quality and timely delivery for automotive, industrial, and data center markets. The role requires a PhD/masters/bachelor in engineering or physical sciences and 15–20 years of experience in packaging, with strong analytical and

Apply now

Level

ManagerL7

Location

Phoenix, AZ

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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