Senior Power Packaging Design Engineer (NPI & OSAT)

renesas electronicsPhoenix, AZyesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Printed Circuit Assembly (Electronic Assembly) Manufacturing

Renesas Electronics Corp. in Phoenix, AZ seeks a senior packaging technologist to lead development for AI/datacenter power packaging and advanced interconnects, including SiC/GaN considerations. You will manage OSAT/CM partners, drive DOE studies, and qualify new packages within aggressive timelines. Candidate should have 15–20 years in power package development, strong wafer-level/flip-chip expertise, and excellent analytical and presentation skills.

Apply now

Level

SeniorL5

Location

Phoenix, AZ

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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