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Senior IC Package Layout Engineer 2.5D/3D-IC

L5

amazonTempe, AZ10 days ago

Occupations

Computer Hardware EngineersElectronics Engineers, Except ComputerPackers and Packagers, Hand

Industries

Printed Circuit Assembly (Electronic Assembly) ManufacturingSemiconductor and Related Device ManufacturingSemiconductor Machinery Manufacturing
Annapurna Labs (U.S.) Inc. within AWS is seeking a Package Layout Design Engineer to advance IC packaging for AI/ML hardware. You will handle floor planning through tape-out, collaborating with SI/PI, thermal, and manufacturing to meet performance targets. Role requires hands-on experience with package layout tools and a deep understanding of 2.5D/3D-IC, RDL, TSV, and interposer technologies. Great communication and teamwork are essential.
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Apply now (opens in a new tab)

Level

SeniorL5

Location

Tempe, AZ

Occupation

Computer Hardware Engineers

Industry

Printed Circuit Assembly (Electronic Assembly) Manufacturing

Posted

10 days ago

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