Thermal & Mechanical Packaging Engineer - Data Center

jobleadsusAustin, TXyesterday

Occupations

Mechanical Engineers Computer Systems Engineers/Architects Engineers, All Other

Industries

Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services Electronic Computer Manufacturing Semiconductor and Related Device Manufacturing

Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure. You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.

Apply now

Level

LeadL6

Location

Austin, TX

Occupation

Mechanical Engineers

Industry

Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services

Posted

yesterday

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