Process Engineer Advanced Packaging

PURPOSE: - To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)PRINCIPLE ACCOUNTABILITIES / DUTIES:Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom. Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment. Create, improve and document optical splicing and routing for fiber optics box build assembly. Lead root cause analysis and corrective actions for process excursions. Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies. Design and order necessary tooling and ensure availability of all consumablesPREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)