Senior Advanced Packaging Architect (3DIC/Interposers)
jobleadsusSan Diego, CA
Senior Advanced Packaging Architect (3DIC/Interposers)
L6
jobleadsusSan Diego, CAtoday
Occupations
Computer Hardware EngineersComputer Systems Engineers/ArchitectsElectronics Engineers, Except ComputerIndustries
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingComputer Systems Design ServicesSynopsys, Inc. in San Diego, CA is seeking a seasoned hardware engineering professional focused on advanced silicon package design and multi-physics analysis. You will drive SIPI performance, develop interposers and RDL-based packages, and guide silicon packaging strategies with Synopsys IPs.
You will collaborate with cross-functional teams, mentor peers, and lead technical discussions in a fast-paced environment, supporting customer engagements and innovation initiatives.
Apply now
Level
LeadL6
Location
San Diego, CA
Occupation
Computer Hardware Engineers
Industry
Semiconductor and Related Device Manufacturing
Posted
today
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