Senior Power Package Design Lead

Renesas Electronics Corp. seeks an experienced semiconductor packaging leader to drive technology development and NPI execution for power SiP/modules and high‑reliability interconnect solutions. You will collaborate with OSATs, suppliers, and internal teams to meet schedule, cost, and quality targets. The role requires 12–15 years in package development, with a strong background in wafer‑level packaging, flip‑chip, and power packaging technologies.