Director, IC Packaging Simulation & Engineering

L7

qualcommSan Diego, CAyesterday
Qualcomm is seeking a Director to lead the Mechanical Simulation function in San Diego, California. This senior leadership role involves delivering mechanical simulation solutions to support chipsets and packaging technologies. The ideal candidate will have substantial experience in FEA modeling and significant people management skills, overseeing engineering teams and driving strategic initiatives. Competitive salary, annual bonus and RSU grants available.
Apply now
Apply now

Level

ManagerL7

Location

San Diego, CA

Occupation

Mechanical Engineers

Industry

Semiconductor Machinery Manufacturing

Posted

yesterday

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