Packaging Process Engineer – Advanced Semiconductors

intelBrooklyn, NYyesterday

Occupations

Semiconductor Processing Technicians Packers and Packagers, Hand Packaging and Filling Machine Operators and Tenders

Industries

Semiconductor and Related Device Manufacturing Semiconductor Machinery Manufacturing Electronic Computer Manufacturing

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, AZ seeks a Packaging Module Development Engineer to develop, optimize, and qualify advanced semiconductor packaging processes for high-volume production. You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.

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Level

MidL4

Location

Brooklyn, NY

Occupation

Semiconductor Processing Technicians

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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