Senior Director, Chiplet Packaging & HDFO Strategy

Amkor Technology in Tempe, AZ, seeks a Sr. Director, Chiplets/FCBGA to lead the strategy, development and execution of advanced chiplet-based packaging solutions for AI, HPC, networking, and PC markets. You will drive roadmaps and commercialization with Tier 1 customers and Amkor's R&D center in Korea. The role requires 12+ years in semiconductor packaging, a Bachelor's in Engineering (Master's preferred), and strong leadership in global programs, with 20% domestic and 20% international travel.