Process Engineer, Advanced Packaging & Die Bonding

L4

fabrinet westSanta Clara, CAyesterday
Fabrinet West in Santa Clara, CA is seeking an engineer to develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom. You will create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and optical alignment equipment, while leading root cause analysis and defining inspection criteria.
Apply now
Apply now

Level

MidL4

Location

Santa Clara, CA

Occupation

Engineers, All Other

Industry

Semiconductor Machinery Manufacturing

Posted

yesterday

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Process Engineer, Advanced Packaging & Die Bonding at fabrinet...