SoC Power & Physical Architect for Next-Gen HBM
micron usaFolsom, CA
SoC Power & Physical Architect for Next-Gen HBM
L6
micron usaFolsom, CAyesterday
Industries
Semiconductor and Related Device ManufacturingElectronic Computer ManufacturingComputer Storage Device ManufacturingMicron Technology, a world leader in memory and storage, seeks an experienced SoC Power and Physical Architect in the Next-generation HBM Architecture Team in California. You will drive SoC specifications for 3D-stacked high-bandwidth memories, analyze power delivery and thermal implications, define IP interfaces, clocking, PDN, DFT, floorplanning, and maintain clear physical documentation. The role involves collaborating with architecture and design teams to deliver high-performance memory
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Level
LeadL6
Location
Folsom, CA
Occupation
Computer Hardware Engineers
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
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