Senior ASIC Package Design Engineer
virtual vocationsNew York, NY
Senior ASIC Package Design Engineer
L5
virtual vocationsNew York, NY8 days ago
Occupations
Electronics Engineers, Except ComputerComputer Hardware EngineersTelecommunications Engineering SpecialistsIndustries
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingSatellite TelecommunicationsTo support the development of high-performance satellites, the remote Senior ASIC Package Design Engineer will implement advanced ASIC package architecture, focusing on flip-chip BGA and multi-chip module solutions, while collaborating with internal teams and managing vendor relationships.
Key responsibilities:
Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery
Lead package-level trade studies across performance, power integrity, and manufacturability
Establish package design standards and drive detailed design of high-pin-count ASIC packages
Required qualifications:
Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
5+ years of experience in ASIC package design, with expertise in FC-BGA
Proven experience delivering high-pin-count, high-performance ASIC packages into production
Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
Apply now
Level
SeniorL5
Location
New York, NY
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
8 days ago
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