Advanced Packaging TD Intern: AI-Driven Analytics

Micron Technology, Inc. looks for a motivated Advanced Package TD Process Intern to support development of hybrid bonding, TSV, and other interconnect technologies. You will work with engineers to perform DoE, analyze yield data, monitor line performance, and contribute to process optimization while leveraging AI and Code Assist to accelerate engineering analysis. Responsibilities include presenting findings, collaborating across sites, and shaping experimental designs in a fast-paced