Senior Package Design Engineer - Power & Chiplet Packages

smartrecruitersTempe, AZyesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Printed Circuit Assembly (Electronic Assembly) Manufacturing

Renesas is seeking a Staff Package Design Engineer to join the Advanced Silicon Packaging team in Austin, TX or Tempe, AZ. You will design and deliver high-performance semiconductor package solutions, including power modules and chiplet-based architectures for automotive, industrial, IoT, and AI-enabled platforms. The role requires deep expertise in package layout, manufacturability, assembly constraints, and cross-domain co-design with global teams.

Apply now

Level

LeadL6

Location

Tempe, AZ

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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