Senior Physical Design Engineer — 3nm CPU APR & Signoff

MediaTek is seeking a Senior Physical Design Engineer to drive APR and PV signoff for high‑performance CPU cores in 3nm and other node technologies. You will own critical implementation stages—from early PPA evaluation to clock tree design and signoff—delivering silicon‑proven CPU solutions. You will collaborate with front‑end, STA, IR/EM, and verification teams to close timing, power, and physical design issues, while refining methodologies for quality, scalability, and faster turnaround.