Staff Foundry Technology Reliability Engineer – HBM | Micron Technology | Folsom
L6
nanohelpFolsom, CAyesterday
$114,000 per year
Industries
Semiconductor and Related Device ManufacturingElectronic Computer ManufacturingSemiconductor Machinery ManufacturingStaff Foundry Technology Reliability Engineer – HBM | Micron Technology | Folsom Micron Technology’s Heterogeneous Integration Group (HIG) is leading the development of High Bandwidth Memory (HBM)for AI and ML applications — a breakthrough in semiconductor miniaturization. Leveraging Through Silicon Via (TSV)technology, the team stacks DRAM dies and logic in a single package, achieving unmatched memory density and speed.
This role focuses onnano-enabled reliability engineeringto push the limits of advanced FinFETandTSV-based architectures. Lead reliability engineering for cutting-edgeHBM productsat Micron Technology, Folsom. Collaborate across design, foundry, and R&D teams to assess, model, and optimize nanotechnology-enabled process reliability for FinFET nodesandTSV interconnects.
Responsibilities:
Define, assess, and optimize reliability specifications for advanced FinFET-based base diesand TSV interconnect structures.
PerformTMI_Aging simulationsfor both digital and custom flows, evaluate degradation due toBTI, HCI, SHE, TDDB, and setelectromigration limitsfor TSV chains.
Requirements:
BS in EE/CS or related + 3+ years relevant experience
Foundry PDKs, CMOS design, EDA tools, reliability simulations
Micron’s HIG team is pushing the frontiers ofheterogeneous integration, delivering high-performance High Bandwidth Memory (HBM)solutions for AI/ML workloads that demand extreme memory bandwidth. This is not just incremental semiconductor work — it’s deepnanotechnology-enabled packaging, usingTSVto vertically integrate multiple dies for minimal latency and maximum throughput.
What We Offer: Competitive salary + bonus + stock options
Salary range:
$114,000 – $280,000 USD
Micron is an equal opportunities employer and welcomes applications from all qualified candidates. We are committed to a diverse and inclusive workplace.
Apply now
Level
LeadL6
Salary
$114,000 per year
Location
Folsom, CA
Occupation
Microsystems Engineers
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
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