Senior Wafer Bonding Process Engineer

Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches. You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.