Senior Director, Chiplet Packaging & FCBGA Innovation

Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets. The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.