Lead ASIC Package Design Projects High-Speed AI/HPC

Broadcom Inc. is seeking an experienced IC Package Design Project Manager to lead a team developing complex flip-chip-BGA packages for high-performance ASICs in AI, HPC, and 5G. You will manage 20+ designs, coordinate with vendors and internal teams, and drive packaging methodologies in a global R&D setting. The role requires on-site work at Broadcom offices five days a week, with occasional travel. Strong background in package design, SI/PI, and cross-functional collaboration is essential.