Senior Chiplet Packaging & Design Enablement Lead
rapidus usSanta Clara, CA
Senior Chiplet Packaging & Design Enablement Lead
L5
rapidus usSanta Clara, CAyesterday
Occupations
Electronics Engineers, Except ComputerComputer Hardware EngineersRadio Frequency Identification Device SpecialistsIndustries
Printed Circuit Assembly (Electronic Assembly) ManufacturingElectronic Connector ManufacturingSemiconductor and Related Device ManufacturingRapidus Corporation US is seeking a Customer Package Design Integration Engineer to drive chiplet-based product development and packaging technology integration. You will serve as the primary technical interface between Rapidus and customers, aligning ADKs, packaging, and customer design activities toward successful tape-out.
You will combine deep expertise in 2.5D/3D packaging with program management and cross-functional coordination to lead designs from bring-up through tape-out across global
Apply now
Level
SeniorL5
Location
Santa Clara, CA
Occupation
Electronics Engineers, Except Computer
Industry
Printed Circuit Assembly (Electronic Assembly) Manufacturing
Posted
yesterday
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